Dowsil 7920LV High-Performance One-Part Thermal Die Attach in Microelectronics Packaging
Basic Product Attributes
DOWSIL™ 7920-LV Die Attach Adhesive is a one-part, black, thixotropic silicone adhesive with self-priming capability. It cures upon heating for flexible processing, features a low modulus to minimize stress, offers optimized viscosity for ease of dispensing, and is solventless to reduce voiding potential.
Product Description
DOWSIL™ 7920-LV is a high-performance silicone material specifically formulated for microelectronic die attach applications. Its core composition is based on Polydimethylsiloxane (PDMS). Once cured, it retains excellent stability in physical and electrical properties over a broad range of operating conditions, significantly enhancing the long-term reliability and service life of packaged assemblies. Its stable chemistry and versatile processing options provide substantial user benefits.
Key Advanced Properties
Key advantages of this adhesive lie in its low modulus design (Tensile Modulus ~6.8 MPa), which effectively absorbs and dissipates stresses induced by coefficient of thermal expansion (CTE) mismatch, protecting sensitive dies and substrates. Its optimized thixotropy (Thixotropic Ratio 2.3) ensures excellent shape retention during dispensing, preventing sag, and is ideal for precision application. The self-priming feature enables strong adhesion to commonly used microelectronics substrates (e.g., aluminum, Lap Shear ~7.3 MPa). As a solventless one-part system, it eliminates mixing steps, simplifies operation, and minimizes the risk of void formation during cure.
Application Scenarios
DOWSIL™ 7920-LV is designed for microelectronics packaging requiring high-reliability bonding and good thermal performance. Its low viscosity and low modulus make it particularly suitable for attaching small, thin dies (e.g., thin silicon dies, GaAs dies) and for applications sensitive to thermomechanical stress. Typical applications include:
- Power Semiconductor Packaging: Die attach for MOSFETs, IGBTs, Power Diodes, where low stress protects die integrity.
- Optoelectronic Device Packaging: Attaching LED dies, optical sensors, providing stable mechanical support and a thermal conduction path.
- Sensor & MEMS Packaging: Low modulus minimizes detrimental packaging stress on sensor accuracy.
- Other High-Reliability Microelectronics Assembly: Suitable for advanced packaging forms requiring stable bonding and good electrical insulation.
| Property | Unit | Typical Value |
| Physical Properties | | |
| Viscosity | cP | 14,500 |
| Thixotropic Ratio | - | 2.3 |
| Specific Gravity | - | 1.2 |
| Durometer Hardness | Shore A | 70 |
| Cure Profile (At 150°C) | | |
| Cure Time | minutes | 60 |
| Mechanical Properties | | |
| Tensile Strength | MPa | 9 |
| Elongation | % | 120 |
| Tensile Modulus | MPa | 6.8 |
| Lap Shear Strength (Al) | MPa | 7.3 |
| Electrical Properties | | |
| Dielectric Strength | kV/mm | 21 |
| Dielectric Constant (1 MHz) | - | 3.0 |
| Dissipation Factor (1 MHz) | - | 0.0019 |
| Volume Resistivity | Ohm-cm | 1.7 × 10¹⁵ |
| Ionic Purity | | |
| Chloride (Cl⁻) | ppm | <5 |
| Sodium (Na⁺) | ppm | <2 |
| Potassium (K⁺) | ppm | <2 |
1. Who are we?
We are Shenzhen Huazhisheng New Material Technology Co., Ltd., a professional industrial adhesives and sealants supplier based in China since 2018. we serve global markets: Mainland China (60%), Southeast Asia (20%), North America (10%), and Europe (10%).
2. What products do you offer?
we supply high-performance adhesives and sealants from global leaders including:
Cemedine, Dow Corning, Shin-Etsu, Araldite, and Momentive,etc.
3. How do you guarantee product quality?
Quality assurance through:
Mandatory pre-production samples approval
Final inspection by QC team before shipment
International certifications: SGS, UL, FDA, RoHS, REACH
4. Why choose us over other suppliers?
Reliable Supply:Authentic products from top manufacturers
Expert Support:Technical guidance for product selection
Global Compliance:Certifications meeting target market standards
Efficient Service:Customized solutions & professional support
5. What services do you provide?
Delivery:EXW/FOB/CIF
Payment:USD/EUR/CNY/HKD via T/T, L/C
Support:Technical consultation & logistics coordination
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Dowsil 7920LV One Part Thermal Die Attach Adhesive In Microelectronics Packaging Images
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